Complaint
| .1 to 36-layer rigid and 2-to 14-layer flex and rigid flex PCBs |
| .Blind/buried vias with sequential lamination |
| .HDI build up micro via technology with solid copper filled vias |
| .Via in pad technology with conductive and non-conductive filled vias |
| .Heavy-copper up to 12oz.Board thickness up to 6.5mm.Board size up to 1010X610mm. |
| .Special materials and hybrid construction |
Specification
| Term | Detailed Specification of PCBA Board Manufacturing |
| Layer | 1-36 layer |
| Material | FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, FR-1, FR-2, Aluminum,Rogers,Taconic,Isola..etc |
| Board thickness | 0.4mm-4mm |
| Max.finished board side | 1900*600mm |
| Min.drilled hole size | 0.1mm |
| Min.line width | 2.95mil |
| Min.line spacing | 2.95mil |
| Surface finish/treatment | HASL/HASL lead free,Chemical tin/Gold,Immersion gold/Silver,OSP,Gold Plating,Gold finger. |
| Copper thickness | 0.5-100oz |
| Solder mask color | green/black/white/red/blue/yellow/purple |
| Inner packing | Vacuum packing,Plastic bag |
| Outer packing | Standard carton packing |
| Hole tolerance | PTH:±0.075,NTPH:±0.05 |
| Certificate | UL,ISO9001,ISO14001,ROHS,CQC,TS16949 |
| Profiling Punching | Routing,V-CUT, Beveling |
| Assembly Service | Providing OEM service to all sorts of printed circuit board assembly |
| Technical Requirement | Professional Surface-mounting and Through-hole soldering Technology |
| Various sizes like 1206,0805,0603 components SMT technology | |
| ICT(In Circuit Test),FCT(Functional Circuit Test) technology | |
| PCBA Assembly With CE,FCC,Rohs Approval | |
| Nitrogen gas reflow soldering technology for SMT | |
| High Standard SMT&Solder Assembly Line | |
| High density interconnected board placement technology capacity | |
| Quote&Production Requirement | Gerber File or PCBA File for Bare PCBA Board Fabrication |
| Bom(Bill of Material) for Assembly,PNP(Pick and Place file) and Components Position also needed in assembly | |
| To reduce the quote time, please provide us the full part number for each components, Quantity per board also the quantity for orders. | |
| Testing Guide & Function Testing method to ensure the quality to reach nearly 0% scrap rate |
| PCB Assembly OEM Service |
| Electronic Components Material Purchasing |
| Bare PCB Fabrication |
| Cable, Wire-harness Assembly, Sheet Metal, Electrical Cabinet Assembly Service |
| PCB Assembly Service: SMT, BGA, DIP |
| PCBA test: AOI, In-Circuit Test (ICT), Functional Test (FCT) |
| Conformal Coating Service |
| Prototyping and Mass Production |
| PCBA ODM service |
| PCB Layout, PCBA Design According To Your Idea |
| PCBA Copy/Clone |
| Digital Circuit Design / Analog Circuit Design/ lRF Design /Embedded Software Design |
| Firmware and Microcode Programming Windows Application (GUI) Programming/Windows Device Driver (WDM) Programming |
| Embedded User Interface Design / lSystem Hardware Design |
PRODUCT SHOW
FACTORY AND EQUIPMENT
| * Gerber files of the bare PCB |
| * Bill of materials include: Manufacturer's part number, type of part, type of packaging,component locations listed by reference designators and quantity |
| * Dimensional specifications for non-standard components |
| * Assembly drawing, including any change notice |
| * Pick and Place file |
| * Final test procedures (if customer need us test) |
