PCB Item Manufacture Capacity | ||||
Layer Counts | 1L-40L | Min Hole Size(mechanical) | 0.15mm | |
Base Material | NY,SYL,TUC,EMC,Isola,Rogers,Arlon,Nelco,Taconic,Panasonic | Min Hole Size(laser hole) | 0.1mm | |
FPC Material | Dupont,Taiflex,SYL,Thinflex | Hole Size Tol (+/-) | PTH:+0.075mm; NPTH: +0.05mm | |
Material Thickness(mm) | T=0.1mm-3.2mm | Hole Position Tol | ±0.075mm | |
Max board size(mm) | 1250mm x570mm | HASL/LF HAL | 2.5um | |
Board Outline Tolerance | ±0.10mm | Immersion Gold | Nickel 3-7um Au:1-5u" | |
Board Thickness | 0.4mm--3.2mm | Surface Finish | HASL (LF), Gold Plating,Gold Finger,immersion Silver,immersion gold, OSP | |
Thickness Tolerance | ±10% | Copper Weight | 0.5--6 OZ | |
Minimum line/space | 0.05mm/0.05mm | Solder mask | Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue | |
Min Annular Ring | 0.12mm | Silk screen | White, Black, Blue,Yellow | |
Quality Criterion | IPC-A-600J,IPC-6012E,IPC-4101C,IPC-SM-840,IPC-TM-650 UL796 | Certificate | IATF16949;2016 ISO14000 |