Thick copper board refers to a printed circuit board with a copper thickness ≥ 3oz completed in any layer of the inner layer or the outer layer. Second, the characteristics of thick copper plate Thick copper plate has the characteristics of carrying large current, reducing thermal strain, and good heat dissipation.
1. Thick copper circuit boards can carry large currents
In the case of a certain line width, increasing the copper thickness is equivalent to increasing the cross-sectional area of the circuit, which can carry a larger current, so it has the characteristic of carrying a large current.
2. Thick copper circuit board reduces thermal strain
Copper foil has a small electrical conductivity (also called resistivity,1.72*10-8ΩΩ·m) when the temperature rise is small when a large current is passed, so it can reduce the amount of heat and thus reduce the thermal strain. The conductivity is the resistivity. Metal "conductors" are divided into conductivity according to conductivity:
Silver→copper→gold→aluminum→tungsten→nickel→iron.
3. Thick copper circuit board has good heat dissipation
Copper foil has high thermal conductivity (thermal conductivity 401W/mK), which can play an important role in improving heat dissipation performance, so it has good heat dissipation; Thermal conductivity refers to the heat transfer through an area of 1m2 within 1H for a 1m thick material with a temperature difference of 1°C on both sides under stable heat transfer conditions, in W/m·K.
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