Complaint
Stencil Size: | 736x736mm |
Minimum IC Pitch: | 0.2mm |
Maximum PCB size: | 1200x 500mm |
Minimum PCB thickness: | 0.25mm |
Minimum chip size: | 0201 (0.2x0.1)/0603 (0.6 x 0.3mm) |
Maximum BGA size: | 74x74mm |
BGA ball pitch: | 1.00mm (minimum), 3.00mm (maximum) |
BGA ball diameter: | 0.40mm (minimum), 1.00mm (maximum) |
QFP lead pitch: | 0.38mm (minimum), 2.54mm (maximum) |
Volume: | One piece to low volume production quantities Low cost first article builds Schedule deliveries |
Surface mount(SMT) assembly DIP assembly Mixed(surface mount and through hole) technology Single or double sided placement Cable assembly | |
Passive components: As small as 0402 package As small as 0201 with design review Ball Grid Arrays(BGA): As small as .5mm pitch | |
Turnkey(we supply the parts) Consigned(you supply the parts) You supply some parts, we do the rest | |
Solder type: | Leaded Lead-free/ROHS compliant |
Other capabilities: | Repair/rework services Mechanical assembly Box build Mold and plastic injection. |
