Laser parameters | Laser type | picosecond | ||||
wavelength | 355+0.5nm | |||||
average output power | ≤60W | |||||
pulse width | ~5ps | |||||
Beam Quality | M²≤1.2 | |||||
processability | Standard machining dimensions | 500*600(mm)customizable | ||||
maximum processing thickness | ≤20mm(Determined by processing materials and laser configuration) | |||||
Machining accuracy | ≤10μm | |||||
positioning accuracy | ≤±2μm | |||||
Usage environment | Installed power supply | AC220V±5%,L+N+E<4KM | ||||
Equipment size | 2250.0*2100.0*2100.0(mm)Excluding tricolor lights | |||||
equipment quality | About 3000KG | |||||
ambient temperature | 18-28ºC,Environmental cleanliness | |||||
relative humidity | 10-70%(Principle of non condensation) |