Metallographic Cold Mounting Compounds Cold Mounting Metallography Cold Mounting Epoxy Resin

Min.Order: 1

Product origin: Suzhou, Jiangsu, China

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Complaint

US$ 28 ~ 45

Description

TJ 2210 Acrylic Resin
It is widely used in PCB,SMT and semiconductor;Curingquickly,smooth,high transparency,no air bubbles; Curing time is 8-12min(25ºC)

Acrylic resin agent is a resin glue composed of powder and liquid, that is, composed of acrylic powder and liquid curing agent.
It is composed of metallographic acrylic powder and metallographic curing agent. Mix the curing agent with acrylic powder at room
temperature (20-25ºC), and it can be cured into a transparent hard material after 10-15 minutes, and the material can be ground and
polished. It has the advantages of low heat release, small thermal shrinkage, good weather fastness and good wear resistance. It
is suitable for making permanent specimens and micro-slicing materials for circuit boards and metalworking industries.

Fast curing, stable, high transparency;

Low viscosity, excellent flow properties;

Excellent permeability to small pores and depressions;

Good support for the slices after curing of the slices;

Sufficient hardness and toughness after curing;

Sufficient brightness after polishing;

Low shrinkage before and after curing ;

Suit with all currently known soft or hard plastic molds;

Low exotherm, peak temperature <73°C (20g, room temperature 20-22°C)

Appearance	Acrylic Powder: White powder.
Curing Agent	Colorless to pale green transparent liquid.
Shrinkage	≤2%
Transmittance	≥93%
Brinell hardness (kg/mm2)	≥12
Impact strength (kg.cm/cm2)	≥5
Abrasion resistance	excellent