High Temperature Heat Insulation Materials Refractory Ceramic Fiber Board Building Material Ceramic Plate for Heating Furnace

Ceramic Fiber Boards are manufactured in a wet forming process using alumina-silica fibers and binders.  Lower thermal conductivity, superior mechanical properties and high-temperature stability offer unmatched performance reliability.They can help reduce energy costs and cycling times once being installed in furnace ,boiler lining. If wet by water, steam or oil, thermal and physical properties are restored upon drying.
In order to provide handling strength during the manufacturing process, small quantities of organic and inorganic binders are typically added to the board formulation. Where present, the organic binding agents burn out at temperatures between 450°F/232°C to 600°F/316°C during initial heat up by the end user. Following burnout of the organic binder, the boards are white in color.

Features

• Can be machined,cut and shaped easily                                                                    • Excellent thermal shock resistance

• High rigidity and light weight                                                                                       • Low thermal conductivity and low heat storage


Typical Applications

• Furnace, Kiln, and Oven hot face and backup linings                                                 • Flue and Chimney linings, Hot gas duct lining
• Consumer appliances like ovens, water heaters, night storage heaters                     • Gaskets, Seals, Expansion joints
• Heat Shields for personal protection                                                                           • Heat processing equipment

We participate the 6th metal shanghai expo and 15th International Metallurgical Industry Expo. Many our regular customers also came to visit us.

Our company has professional and strict quality control for all the products. We have passed CE certificate on 2016.

And we also passed MSDS,  ISO9001 quality management system certification and REACH etc.