Boost Pfc PC Power Osg65r038hzaf To247 Vds 650V RDS38mΩ Fast Recovery Diode High Voltage Regulator Mosfet

Min.Order: 660
Product origin: Shanghai, China
Infringement complaint: complaintComplaint
US$ 0.2

Description
General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Z series is integrated with fast recovery diode (FRD) to minimize reverse recovery time. It is suitable for resonant switching topologies to reach higher efficiency, higher reliability and smaller form factor.

Features
  • Low RDS(ON) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity
  • Ultra-fast and robust body diode

Applications                                                                                           
  • PC power
  • Telecom power
  • Server power
  • EV Charger
  • Motor driver

Key Performance Parameters
 
ParameterValueUnit
VDS, min @ Tj(max)700V
ID, pulse240A
RDS(ON), max @ VGS=10V38
Qg175nC

Marking Information
 
Product NamePackageMarking
OSG65R038HZFTO247OSG65R038HZ
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
ParameterSymbolValueUnit
Drain-source voltageVDS650V
Gate-source voltageVGS±30V
Continuous drain current1), TC=25 °C
ID
80
A
Continuous drain current1), TC=100 °C50
Pulsed drain current2), TC=25 °CID, pulse240A
Continuous diode forward current1), TC=25 °CIS80A
Diode pulsed current2), TC=25 °CIS, pulse240A
Power dissipation3) ,TC=25 °CPD500W
Single pulsed avalanche energy5)EAS2900mJ
MOSFET dv/dt ruggedness, VDS=0…480 Vdv/dt100V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤IDdv/dt50V/ns
Operation and storage temperatureTstg, Tj-55 to 150°C

Thermal Characteristics
 
ParameterSymbolValueUnit
Thermal resistance, junction-caseRθJC0.25°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
ParameterSymbolMin.Typ.Max.UnitTest condition

Drain-source breakdown voltage

BVDSS
650  
V
VGS=0 V, ID=2 mA
700770 VGS=0 V, ID=2 mA, Tj=150 °C
Gate threshold
voltage
VGS(th)3.0 4.5VVDS=VGS, ID=2 mA

Drain-source
on-state resistance

RDS(ON)
 0.0320.038
Ω
VGS=10 V, ID=40 A
 0.083 VGS=10 V, ID=40 A, Tj=150 °C
Gate-source leakage current
IGSS
  100
nA
VGS=30 V
  -100VGS=-30 V
Drain-source leakage currentIDSS  10μAVDS=650 V, VGS=0 V
Gate resistanceRG 2.1 Ωƒ=1 MHz, Open drain

Dynamic Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Input capacitanceCiss 9276 pF
VGS=0 V, VDS=50 V,
ƒ=100 kHz
Output capacitanceCoss 486 pF
Reverse transfer capacitanceCrss 12.8 pF
Effective output capacitance, energy relatedCo(er) 278 pF
VGS=0 V, VDS=0 V-400 V
Effective output capacitance, time relatedCo(tr) 1477 pF
Turn-on delay timetd(on) 55.9 ns
VGS=10 V, VDS=400 V, RG=2 Ω, ID=40 A
Rise timetr 121.2 ns
Turn-off delay timetd(off) 114.2 ns
Fall timetf 8.75 ns

Gate Charge Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Total gate chargeQg 175.0 nC

VGS=10 V, VDS=400 V, ID=40 A
Gate-source chargeQgs 40.1 nC
Gate-drain chargeQgd 76.1 nC
Gate plateau voltageVplateau 6.4 V

Body Diode Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Diode forward voltageVSD  1.3VIS=80 A, VGS=0 V
Reverse recovery timetrr 180 ns
IS=30 A,
di/dt=100 A/μs
Reverse recovery chargeQrr 1.5 uC
Peak reverse recovery currentIrrm 15.2 A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. The value of RθJA is measured with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with Ta=25 °C.
  5. VDD=300 V, VGS=10 V, L=40 mH, starting Tj=25 °C.

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