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IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell
IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell
IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell
IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell
IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell
IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell

IC Electronic Components Sop Packaging Black Ceramic 8-Wire Shell

Min.Order: 500
Product origin: Fuzhou, Fujian, China
Infringement complaint: complaintComplaint
US$ 1.33

Description
Integrated Circuit Ceramic Flat Package(SOP type and CQFP type)
Black ceramic cryogenic glass packaging is a technology that uses low melting point glass and black alumina ceramics as materials to package and protect IC chips, small size, with good mechanical, electrical and chemical properties, and packaging process is simple, low price, high palmability. Suitable for mass production can be widely used in military and civil products, with broad market prospects and development space
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