Process Projects | Aluminum plate | Ceramic substrates |
sheets | TengHui(Max8W), BoYu, SangYi | Aluminum Oxide>=24W,Aluminum Nitride>=170W(Nakagawa,Maruwa) |
Layers of lamination | 1-2 floors | 1-2 floors |
Size (Maximum Typeset Sheet) | 1180*480mm | Minimum 114*114mm/Maximum 138*190mm |
Finished plate thickness | 0.8-6.0mm | 0.25, 0.3, 0.38, 0.5, 0.635, 1 |
Minimum Finished Hole Diameter | Single-sided double layer 0.3mm / Double-sided double layer 0.5mm | 0.075mm |
aspect ratio | 1:6 | 1:12 |
Inner layer line width/spacing | / | / |
Inner copper foil thickness | / | / |
Minimum Dielectric Layer Thickness | / | / |
Thickness of outer copper foil | 1/3oz-4oz | / |
Outer layer line width/spacing | 0.2mm | 0.08mm |
Minimum SMD width | 0.2mm | / |
Maximum Full Plug Bore Diameter | / | 0.6mm |
Solder Resist Bridge Width | 0.2mm | 0.075mm (green oil/1OZ) |
Molding size tolerance | ±0.1mm / Limit ±0.05mm | ±0.08mm/limit ±0.05mm |
Distance from smallest hole to edge molding | 0.075-0.15mm | / |
Minimum angular accuracy tolerance for beveled edges | / | / |
interlayer alignment | / | / |
Inner Minimum Insert Hole Hole Ring | / | / |
Outer Minimum Insert Hole Hole Ring | / | / |
surface treatment | OSP, immersion gold, lead-free spray tin, immersion silver, electroplated silver | Silverized silver, sunken gold, nickel-palladium gold, electro-gold |
Bend & Warp Flatness | ≤0.5% | ≤0.15% |
Q1.What files for quotation?
A:PCB files(gerber), BOM list, XY Data(pick-N-place).
Q2.MOQ and what is King Field fastest delivery time?
A:1pcs. Sample to mass production all can be supported by King Field.
Q3.For PCB quotation , what files format do King Field need?
A:Gerber, Protel 99SE, DXP, PADS 9.5, AUTOCAD,CAM350 are OK.
Bare PCB prototype PCBA(PCB Assembly)
Layer | Quick turn | Quantity | Quick turn |
2 | 24hours | <30pcs | 1 days |
4 | 48hours | 30-100pcs | 2 days |
6-8 | 72hours | 100-1000pcs | 5 days |