Semiconductor Welding Line Multifunctional Bonding Machine Gold Wire Wedge Bonder

Min.Order: 1

Product origin: Guangzhou, Guangdong, China

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US$ 43800 ~ 73000

Description

Equipment introduction
MDHX-M6000 multifunctional bonder is a manual bonding equipment used to connect the chip pads to the pads on the substrate or lead frame with platinum wire, gold wire/tape, aluminum wire, silver wire or copper wire. It is a semiconductor One of the key equipment necessary for the post-packaging process on the production line.
MDHX-M6000 bonding machine has two functional modes of ball welding and wedge welding. It adopts XYZ integrated operation handle and electric brake structure, which makes the equipment operation flexible and convenient; unique ultrasonic control algorithm, stable ultrasonic output frequency and fast response speed; FPGA parallel Control algorithm design, fast bonding speed; high-precision voice coil motor force control technology and force compensation algorithm design, precise bonding pressure
control, high bonding accuracy; integrated design of the whole machine, compact structure, good user experience.
Figure 1.1 Appearance of MDHX-M6000 Multifunctional Bonding Machine
Main parameters
Table 1.1 Main performance index of M6000 bonder

Wire diameter	Gold wire: 15 μm - 100 μm
	Platinum wire: 18 μm - 100 μm
	Aluminium wire: 18 μm - 100 μm
	Copper wire : 18 μm - 25 μm
	Gold Ribbon: 50 μm ×12.5 μm - 300 μm × 25.4 μm
Chopper Type	Φ1/16 1 6 mm ball welding chopper
Chopper Type	Φ1/16, Φ3/32 19mm, 25mm wedge welding chopper
Maximum cavity depth	16mm
Welding pressure	1-250g, 1g subdivision step; program control, interface adjustable
Brake method	Electric, no compressed air required
Pressure welding head vertical stroke	20mm
Pressure welding head horizontal stroke	15mm×15mm (operating handle ratio 8:1)
Wire clamp feeding stroke	800 μm
Feeding method	90° (deep cavity) or 45°
Liftable workbench	Liftable height: 20 mm
Liftable workbench	Area: 270mm× 2 65mm
Ultrasound	0-10 W, maximum accuracy 0 .4 mW
wire feeder	1/2" or 2" spool
Interactive interface	7" TFT LCD touch screen, menu can be switched between Chinese and English
Fixture	2", 3", 4" slotted/unslotted hot or cold bench

Equipment application fields
MDHX-M6000 multifunctional wire bonder is widely used in microwave devices, hybrid circuits, RF devices/ modules, discrete devices, sensors, COB modules, MCM, MEMS devices, optoelectronic devices, etc.
Standard configuration
Table 1.2 Standard configuration of M6000 bonder

Name	model
Device host	MDHX-M6000 (Ball and wedge welding bonder)
thermostat	220VAC 50/60Hz
Clamping table	3″ non-slotted countertop with clips, 200°C
microscope	15X magnification
spool	1/2″
wire clip	90°
Liftable workbench	Stroke: 20mm
LED Ring Light	6W, stepless adjustment of brightness

Peripheral parameters
Table 1.3 Peripheral parameters of M6000 bonder

name	model
Input voltage	220VAC±10%
power	500W _
frequency	50Hz - 60Hz
Dimensions	603mm (L)X596mm ( W) X319mm (H)
Total Weight	46 kg

Figure 1. 2 MDHX-M6000 Multifunctional Bonding Machine Side View and Dimensions

Figure 1. 3 MDHX-M6000 Multifunction Bonder Top View and Dimensions
FAQ
Q: How to buy your products ?
A: We have some products in stock , you can take away the products after you arrange the payment ;
If we don't have the products in stock you want, we will start production once getting the payment.
Q: What's the warranty for the products ?
A: The free warranty is one year from the date of commissioning qualified.
Q: Can we visit your factory ?
A: Of course, welcome to visit our factory if you come to China.
Q: How long is the validity of quotation ?
A: Generally, our price is valid within one month from the date of quotation. The price will be adjusted appropriately as the price fluctuation of raw material in the market.
Q: What's the production date after we confirm the order ?
A: This depends on the quantity. Normally, for the mass production, we need about one week to finish the production.

Please contact us for more detail information.

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