Polyamide Hot Melt Adhesive is the polycondensate of dimer acid and diamine.It is solid at room temperature,but liquid uner melting state with good liguidity and adhesive ability,and will form high strength adhesion after
solidifying and cooling. Polyamide hot melt adhesive has excellent thermostability and flexibility,as well as good solubility & melting properties at low temperature.
Item | Index | ||||
BT-208A | BT-208B | BT-208C | BT-288 | BT-208E | |
Acid value ( mgKOH/ g) | ≤ 5 | ≤ 5 | ≤ 5 | ≤ 5 | ≤ 6 |
Amine value (mgKOH/ g) | ≤ 5 | ≤ 5 | ≤ 5 | ≤ 5 | ≤ 6 |
Solvent viscosity* (mPa · s/25ºC) | 150- 190 | 200-300 | 250-450 | 200-400 | 250-450 |
Melt viscosity (mPa ·s/ 160ºC) | 1500-3000 | 2000-4500 | 2000-5000 | 2000-4500 | 3000-8000 |
Softening point (ºC) | 105- 115 | 105- 115 | 100- 110 | 95- 105 | 110- 130 |
Color (Fe-Co) | ≤ 8 | ≤ 8 | ≤ 8 | ≤ 8 | ≤ 8 |
Water-Base Solid Acrylic Resin Solid Acrylic Resin Chlorinated Polypropylene
Cocamide DEA Titanium Dioxide Rutile Grade Styrene Acrylic Copolymer Emulsion