Description
IR rework station T-870A
Features
1\Adopt infrared weld technology which independent exploration.
2\Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco.
3\Easily operate. Just need one day training. Can operation this machine.
4\Don't need weld tools. This machine can weld all the component of 35-50cm.
5\This machine has 800W heating system. Widely to240x180mm.
6\Infrared heating don't have sirocco flow. Don't impact perimeter small component. Can suitable for all of the component, especially Micro BGA component.
7\Definitely can satisfy the computer, the notebook, the electricity swims and so on the BGA sealing off/repairs to request; Specially especially suits to the computer north and south bridge.
Sealing off/repair process
According to product technological requirement or PCB board size, adjustment preheating chassis preheating temperature 60-200; Adjustable), may open the preheating chassis ahead of time, one 3 - 5 minutes, the preheating chassis can stabilize in the temperature range which supposes in advance;
According to the chip size and the welding technological requirement, selects the suitable infrared lamp the heating temperature 100-350 adjustable), can satisfy the sealing off/repair technological requirement then.
The common experience is: According to the repair chip size, adjusts the infra-red lamp suitably the output temperature 100-350; Adjustable) and chassis preheating temperature (60-200; Adjustable);
When the sealing off/repair is smaller than the 20x20mm chip, may adjust the infra-red lamp temperature to 280-320; About, if the chip has not spread the waterproof solid sealing compound, or the PCB board is small cannot distort, but does not operate the preheating chassis preheating; Otherwise first preheating 120-140 degree is suitable;
Opens in a big way, when 30x30mm chip, according to the craft and the user experience, may adjust the infra-red lamp 320-350; About, preheating chassis 140-200; , first preheating 3 - 5 minutes, after and so on the chassis stable are supposing in advance the temperature, may complete the sealing off/repair process very conveniently; This time the infrared light is strongest, the chip elevates temperature quickly, pays attention to the control specially, prevented the sensor displacement, the temperature measurement does not permit, the chip being heated time too is long, the elevation of temperature too is high, hot bad chip.
Complaint
