Description
MoCu alloy is a kind of pseudo-alloy that is composed of molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low adjusted thermal expansion coefficient, Beijing non-magnetic, low content of gas, good vacuum resistance, good machinability and special high-temperature performance, etc.
Compared with WCu alloy, MoCu alloy has lower density and is easier to stamp, It makes MoCu suitable for valume produce.
Product Brief Introduction:
Mo-Cu composite is similar with Tungsten-Copper composite, its thermal expansion coefficient and thermal conductivity can be adjusted to match many different materials, it has lower density, but its CTE is higher than W-Cu.
Surface: Plating Ni, NiAu, NiAg, or Non-plating
Product Properties:
Physical Properties of Major Products
Material
Wt%
Molybdenum Content
Wt%
Copper Content
g/cm3
Density at 20ºC
Thermal conductivity at 25ºC
Coefficient of thermal
expansion at 20ºC
Mo85Cu15
85± 1
Balance
10
160 - 180
6.8
Mo80Cu20
80 ± 1
Balance
9.9
170 - 190
7.7
Mo70Cu30
70 ± 1
Balance
9.8
180 - 200
9.1
Mo60Cu40
60 ± 1
Balance
9.66
210 - 250
10.3
Mo50Cu50
50 ±0.2
Balance
9.54
230 - 270
11.5
Applications:
These composite are widely used in applications, such as, optoelectronics packages, Microwave Packages, C Packages, Laser Sub-mounts, etc.
Product Brief Introduction:
Cu/Mo/Cu(CMC) is a sandwich composite including a molybdenum core layer and two copper clad layers. It has tailorable CTE, high thermal conductivity and high strength. All types of Cu/Mo/Cu sheets can be stamped into components.
The features of copper molybdenum copper
Large sized sheets available (length up to XXmm, width up to XXXmm)
Can be stamped into components
Strong interface bonding resist to 850ºC heat shock repeatedly
Tailorable CTE matching that of semiconductor and ceramics
High thermal conductivity
Product Properties:
Materials
Density at 20ºC
Coefficient of thermal expansion at 20ºC
Thermal conductivity at 25 ºC
In - plane
thru - thickness
13:74:13
9.88
5.6
200
170
1:4:1
9.75
6.0
220
180
1:3:1
9.66
6.8
244
190
1:2:1
9.54
7.8
260
210
1:1:1
9.32
8.8
305
250
Applications:
Applications are similar with W-Cu composites.
Typical Applications: Microwave carriers and heat sinks, BGA Packages, LED packages, GaAs device mounts.
Product Brief Introduction:
Cu/Mo70Cu/Cu(CPC) is a sandwich composite similar to that of Cu/Mo/Cu including a Mo70-Cu alloy core layer and two copper clad layers. The ratio of the thickness in Cu: Mo-Cu: Cu is 1:4:1. It has different CTE in X and γ direction, with higher thermal conductivity than that of W (Mo)-Cu & Cu/Mo/Cu and less expensive. All types of Cu/Mo70Cu/Cu sheets can be stamped into components,.
Features of Cu/Mo70Cu/Cu
Large sized sheets available (length up to XXmm, width up to XXmm)
More easily to be stamped into components than CMC
Very strong interface bonding which can repeatedly resist 850ºC heat shock
Higher thermal conductivity and lower cost
Product Properties:
Materials
Density at 20ºC
Coefficient of thermal expansion at 20ºC
Thermal conductivity at 25 ºC
In - plane
thru - thickness
In - plane
thru - thickness
1:4:1
9.4
7.2
9.0
340
300
Our products
High quality with reasonable price
About FAQ
If you have any question,just feel free to say.We'll also provide you good after-sale service.
Company information
We have been exporting for more than 10 years,worthy of your trust.Hope there's a chance to establish friendly cooperation relations with you from all over the world.
Complaint
