شاحن السيارة طاقة الاتصالات Og65r038hzaf To247 VDS 650V RDS38mأوم السريع منظم الجهد العالي لأنبوب الاستخراص MOSFET

Min.Order: 660
Product origin: Shanghai, China
Infringement complaint: complaintComplaint
US$ 0.2

Description
General Description
The GreenMOS® high voltage MOSFET utilizes charge balance technology to achieve outstanding low on-resistance and lower gate charge. It is engineered to minimize conduction loss, provide superior switching performance and robust avalanche capability.
The GreenMOS® Z series is integrated with fast recovery diode (FRD) to minimize reverse recovery time. It is suitable for resonant switching topologies to reach higher efficiency, higher reliability and smaller form factor.

Features
  • Low RDS(ON) & FOM
  • Extremely low switching loss
  • Excellent stability and uniformity
  • Ultra-fast and robust body diode

Applications                                                                                           
  • PC power
  • Telecom power
  • Server power
  • EV Charger
  • Motor driver


Key Performance Parameters
 
ParameterValueUnit
VDS, min @ Tj(max)650V
ID, pulse240A
RDS(ON), max @ VGS=10V30
Qg178nC

Marking Information
 
Product NamePackageMarking
OSG60R030HZFTO247OSG60R030HZ
Absolute Maximum Ratings at Tj=25°C unless otherwise noted
 
ParameterSymbolValueUnit
Drain-source voltageVDS600V
Gate-source voltageVGS±30V
Continuous drain current1), TC=25 °C
ID
80
A
Continuous drain current1), TC=100 °C50
Pulsed drain current2), TC=25 °CID, pulse240A
Continuous diode forward current1), TC=25 °CIS80A
Diode pulsed current2), TC=25 °CIS, pulse240A
Power dissipation3), TC=25 °CPD480W
Single pulsed avalanche energy5)EAS2500mJ
MOSFET dv/dt ruggedness, VDS=0…480 Vdv/dt50V/ns
Reverse diode dv/dt, VDS=0…480 V, ISD≤IDdv/dt50V/ns
Operation and storage temperatureTstg, Tj-55 to 150°C

Thermal Characteristics
 
ParameterSymbolValueUnit
Thermal resistance, junction-caseRθJC0.26°C/W
Thermal resistance, junction-ambient4)RθJA62°C/W

Electrical Characteristics at Tj=25°C unless otherwise specified
ParameterSymbolMin.Typ.Max.UnitTest condition
Drain-source breakdown voltageBVDSS600  VVGS=0 V, ID=1 mA
Gate threshold voltageVGS(th)3.0 4.5VVDS=VGS, ID=2 mA,

Drain-source
on-state resistance

RDS(ON)
 0.0280.030
Ω
VGS=10 V, ID=40 A
 0.058 VGS=10 V, ID=40 A, Tj=150 °C
Gate-source leakage current
IGSS
  100
nA
VGS=30 V
  -100VGS=-30 V
Drain-source leakage currentIDSS  10μAVDS=600 V, VGS=0 V
Gate resistanceRG 2.1 Ωƒ=1 MHz, Open drain


Dynamic Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Input capacitanceCiss 9343 pF
VGS=0 V, VDS=50 V, ƒ=100 KHz
Output capacitanceCoss 708 pF
Reverse transfer capacitanceCrss 15 pF
Effective output capacitance, energy relatedCo(er) 345 pF
VGS=0 V, VDS=0 V-400 V
Effective output capacitance, time relatedCo(tr) 1913 pF
Turn-on delay timetd(on) 52.1 ns
VGS=10 V, VDS=400 V, RG=2 Ω, ID=40 A
Rise timetr 105.2 ns
Turn-off delay timetd(off) 125.7 ns
Fall timetf 4.1 ns

Gate Charge Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Total gate chargeQg 177.9 nC

VGS=10 V, VDS=400 V, ID=40 A
Gate-source chargeQgs 37.4 nC
Gate-drain chargeQgd 78.4 nC
Gate plateau voltageVplateau 6.2 V

Body Diode Characteristics
ParameterSymbolMin.Typ.Max.UnitTest condition
Diode forward voltageVSD  1.4VIS=80 A, VGS=0 V
Reverse recovery timetrr 186.6 ns
IS=40 A,
di/dt=100 A/μs
Reverse recovery chargeQrr 1.6 μC
Peak reverse recovery currentIrrm 15.4 A

Note
  1. Calculated continuous current based on maximum allowable junction temperature.
  2. Repetitive rating; pulse width limited by max. junction temperature.
  3. Pd is based on max. junction temperature, using junction-case thermal resistance.
  4. VDD=100 V, VGS=10 V, L=80 mH, starting Tj=25 °C.

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