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Fonda High Precision Vertical Double Sided Grinding Machine
Fonda High Precision Vertical Double Sided Grinding Machine
Fonda High Precision Vertical Double Sided Grinding Machine
Fonda High Precision Vertical Double Sided Grinding Machine
Fonda High Precision Vertical Double Sided Grinding Machine
Fonda High Precision Vertical Double Sided Grinding Machine

Fonda High Precision Vertical Double Sided Grinding Machine

Min.Order: 1
Product origin: Shenzhen, Guangdong, China
Infringement complaint: complaintComplaint
US$ 30000 ~ 50000

Description
Why Ponda?
Ponda has profound experience of lapping, polishing and thinning. We heretofore supplied more than 60, 000 lapping process solutions and appliances over the industries of machinery, electronic, aerospace, aviation, automotive, atomic energy, optics; the substances of metal, wafer substrate, ceramics, glass, industrial sapphire, plastics, and any other composites.
Products Show

FD-9BL Double-sided machine main features:
1, the AC frequency conversion motor drive, soft start, soft stop, stable and reliable;
2, grinding machine adopts four stages of pressure, namely light pressure, medium pressure, heavy pressure, repair operation process;
3, line grinding machine adopts PLC program control system and torsion series, frequency control, touch screen and operation panel, motor speed and running time can be directly set input;
4, the equipment adopts the millstone lifting mechanism, not the gear ring lifting, belongs to the pneumatic;
5, the upper plate is separately set up slow drop cylinder, not only effectively prevent the fragile workpiece from breaking, but also independent pressure control;
6, through the use of electronic preset counter, grinding cycle number, requirements can be accurately controlled;
7. Diamond dressing wheel can be used to repair the disk.

APPLICATION
ProcessIndustry by SubstanceIndustry by Applicability
Double
Plate
Lapping
& Polishing		Metal And Alloy
Ceramic
Oxide
Carbide
Glass
Plastic
Nature Stone		Sealingvalve and sealing ring(liquid, oil, gas)
SemiconductorLED substrate(Al2O3, Si, SiC)
wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN)
PlasticPE, E/VAC, SBS, SBR, NBR, SR, BR, PR
Optics(flat)optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass
Gemstonejade, sapphire, agate, etc.
Othersgraphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware.
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed.


SPECIFICATION 
Standard Specification
Machine ModelFD6BFD9BFD13-6B
Lower Plate DiameterΦ386 mm / 15 inchesΦ640 mm / 25 inchesΦ973 mm / 38 inches
Upper Plate DiameterΦ386 mm / 15 inchesΦ640 mm / 25 inchesΦ973 mm / 38 inches
Star Wheel ParameterDP 12, Z=66, A=20°DP 12, Z=108, A=20°DP 19.3, Z=152, A=20°
Conditioning Ring ParameterDP 12, Z=66, A=20°DP 12, Z=108, A=20°DP 19.3, Z=152, A=20°
Max. Workpiece DiameterΦ120 mmΦ180 mmΦ290 mm
Process Thickness0.2mm≤N≤20mm0.2mm≤N≤25mm0.2mm≤N≤30mm
Number of Station3≤N≤53≤N≤53≤N≤5
Plate Rotate Speed0-60 rpm0-60 rpm0-50 rpm
Total Weight600 kg2000 kg3200 kg
Total Floor Space700×950 mm1350x960 mm1700×1380 mm
Built-In Optional Kits
GradeStandardAdvanced
Slurry Supply System-Integrated with PLC
Facing and Grooving System-Integrated with PLC
Machine Enclosure-Framed by Metal Plate
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary.

SAMPLE DEMONSTRATION (DOUBLE PLATE)

About the Company

Factory front desk
Ponda is a high-tech enterprise specializing in all kinds of high precision grinding equipment, polishing equipment and its
supporting products and consumable materials

Production and assembly shop
We have a production workshop and testing equipment, assembly workers and mechanical design engineers
45 people
 
Delivery & Packing
Packing Details  : Packing, 1 pcs/carton.

Patent

FAQs
Q1: Which machine is most applicable for my product?
A: It usually depends on 5 requirements and parameters of your product: flatness, roughness, thickness, dimension, productivity:
1. If better flatness and roughness were required, you might need both lapping and polishing machine.
2. If to thin the product in a big margin, such as 500μm, you might need a thinner machine for extra.
3. If the productivity were excessive, you might need larger machine or to expand production line.
Additionally, we can confirm the production line as we make samples for you.
Q2: Does Ponda charge for making samples?
A: No, it's free to make samples.
Q3: Is Ponda trader or manufacturer?
A: We are manufacturer, certified National High-Tech Enterprise.
Q4: How long does it take machine to deliver?
A: Approximately 15 days to deliver. If the machine are out of stock, we need 15 days more to manufacture.
Q5: Does Ponda provide oversea setup and after-sale service?
A: Yes, we provide oversea service and online tutorial.
Q6: How many type of machine does Ponda manufacture?
A: We have 21 major series of machines, 5 different types run in different principles, more than 15 types of plates, 100 types of slurries.
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