Process | Industry by Substance | Industry by Applicability | |
Double Plate Lapping & Polishing | Metal And Alloy Ceramic Oxide Carbide Glass Plastic Nature Stone | Sealing | valve and sealing ring(liquid, oil, gas) |
Semiconductor | LED substrate(Al2O3, Si, SiC) wafer substrate(Si, SiC, Ge, Ge-Si, GaN, GaAs, GaAsAl, GaAsP, InSb, ZnO, AlN) | ||
Plastic | PE, E/VAC, SBS, SBR, NBR, SR, BR, PR | ||
Optics(flat) | optical lens, optical reflector, scintillator cube, holographic glass, HUD glass, screen glass | ||
Gemstone | jade, sapphire, agate, etc. | ||
Others | graphite block, gauge block, micrometer gauge, diamond, friction plate, knife, bearing, metal components, and any other precise hardware. | ||
*NOTE: lapping can only remove slight thickness of workpiece. If need ultra thinning(≤100μm), thinner machine are needed. |
Standard Specification | |
Grinding disc specification | Φ965xΦ385x45 |
Gear ring lifting height | 35mm |
Main motor | Y132M- 7.5KW |
Planetary wheel specification | DP12Z = 152α =20° |
Lower grinding disc speed | 0-50RPM |
Auxiliary motor | Y90L-4 1.5KW |
Master cylinder | Φ125x450 mm |
Number of planet wheels placed n | 3≤N≤6 |
Sand pump motor | AB-100 250W |
Product grinding parallelism | The 0.002 mm |
Number of planetary wheels | 6 |
Disk repair machine | 200W |
Grinding workpiece thickness b | 0.2mm≤b≤20mm |
Lifting cylinder | Φ80x250 mm |
Grinding workpiece ideal specification | Φ 200 mm |
End lock cylinder | 32x15 mm |
Equipment dimensions | 1700x1350x2650mm (L x W x H) |
Equipment quality | 3000kg |
Built-In Optional Kits | |||||
Grade | Standard | Advanced | |||
Slurry Supply System | - | Integrated with PLC | |||
Facing and Grooving System | - | Integrated with PLC | |||
Machine Enclosure | - | Framed by Metal Plate | |||
*NOTE: the optional kits based on the production requirements, making samples can confirm if they are necessary. |