Complaint
| Technical Capabilities | |||||||
| Items | Speci. | Remark | |||||
| Max panel size | 32" x 20.5"(800mm x 520mm) | ||||||
| Max. Board size | 2000×610mm | ||||||
Min. board Thickness | 2-layer 0.15mm | ||||||
| 4-layer 0.4mm | |||||||
| 6-layer 0.6mm | |||||||
| 8-layer 1.5mm | |||||||
| 10-layer 1.6~2.0mm | |||||||
| Min. line Width/Space | 0.1mm(4mil) | ||||||
| Max. Copper thickness | 10OZ | ||||||
| Min. S/M Pitch | 0.1mm(4mil) | ||||||
| Min. hole size | 0.2mm(8mil) | ||||||
| Hole dia. Tolerance (PTH) | ±0.05mm(2mil) | ||||||
| Hole dia. Tolerance | ,+0/-0.05mm(2mil) | ||||||
| Hole position deviation | ±0.05mm(2mil) | ||||||
| Outline tolerance | ±0.10mm(4mil) | ||||||
| Twist & Bent | 0.75% | ||||||
| Insulation Resistance | >10 12 Ω Normal | ||||||
| Electric strength | >1.3kv/mm | ||||||
| S/M abrasion | >6H | ||||||
| Thermal stress | 288°C 10Sec | ||||||
| Test Voltage | 50-300V | ||||||
| Min. blind/buried via | 0.15mm (6mil) | ||||||
Surface Finished | HASL, ENIG, ImAg, Imsn OSP, Plating AG, Plating gold | ||||||
| Materials | FR4,H-TG,Rogers,Ceramics,Aluminium, Copper base | ||||||
| Min trace width/ space (inner layer) | 4mil/4mil(0.1mm/0.1mm) | ||||||
| Min PAD (inner layer) | 5 mil(0.13mm) | hole ring width | |||||
| Min thickness(inner layer) | 4 mil(0.1mm) | without copper | |||||
| Inner copper thickness | 1~4 oz | ||||||
| Outer copper thickness | 0.5~6 oz | ||||||
| Finished board thickness | 0.4-3.2 mm | ||||||
Board thickness tolerance control | ±0.10 mm | ±0.10 mm | 1~4 L | ||||
| ±10% | ±10% | 6~8 L | |||||
| ±10% | ±10% | ≥10 L | |||||
| Inner layer treatment | brown oxidation | ||||||
| Layer count Capability | 1-30 LAYER | ||||||
| alignment between ML | ±2mil | ||||||
| Min drilling | 0.15 mm | ||||||
| Min finished hole | 0.1 mm | ||||||
| Hole precision | ±2 mil(±50 um) | ||||||
| tolerance for Slot | ±3 mil(±75 um) | ||||||
| tolerance for PTH | ±3 mil(±75um) | ||||||
| tolerance for NPTH | ±2mil(±50um) | ||||||
| Max Aspect Ratio for PTH | 08:01 | ||||||
| Hole wall copper thickness | 15-50um | ||||||
| Alignment of outer layers | 4mil/4mil | ||||||
Min trace width/space for outer layer | 4mil/4mil | ||||||
| Tolerance of Etching | +/-10% | ||||||
Thickness of solder mask | on trace | 0.4-1.2mil(10-30um) | |||||
| at trace corner | ≥0.2mil(5um) | ||||||
| On base material | ≤+1.2mil | ||||||
| Finished thickness | |||||||
| Hardness of solder mask | 6H | ||||||
| Alignment of solder mask film | ±2mil(+/-50um) | ||||||
| Min width of solder mask bridge | 4mil(100um) | ||||||
| Max hole with solder plug | 0.5mm | ||||||
Surface finish | HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver. | ||||||
| Max Nickel thickness for Gold finger | 280u"(7um) | ||||||
| Max gold thickness for Gold finger | 30u"(0.75um) | ||||||
| Nickel thickness in Immersion Gold | 120u"/240u"(3um/6um) | ||||||
| Gold thickness in Immersion Gold | 2u"/6u"(0.05um/0.15um) | ||||||
| Impedance control and its tolerance | 50±10%,75±10%,100±10% 110±10% | ||||||
| Trace Anti-stripped strength | ≥61B/in(≥107g/mm) | ||||||
| bow and twist | 0.75% | ||||||
