PCBA Item Manufacture Capacity | ||||
Items | Capacity | |||
PCB Assembly Min. IC Pitch | 0.20mm(8mil) | |||
PCB Assembly Foot Pin | SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA | |||
PCB Assembly Min. Chip Placement | 201 | |||
PCB Assembly Max. PCB Size | 410mm x 600mm(16.2" x 23.6") | |||
PCB Assembly Maximum BGA Size | 74mm x 74mm(2.9" x 2.9") | |||
PCB Assembly BGA Ball Pitch | 0.2mm/8mil | |||
PCB Assembly BGA Ball Diameter | 0.03mm/1.2mil | |||
PCB Assembly Method | SMT, DIP, AI,MI | |||
PCB Assembly Certification | ISO14000, IATF16949 |