Description
China Low void rate High Vacuum Reflow Solder System HV3-3
Model: HV3-3
Application:
IGBT/DBC
Power Semiconductors
Sensors
MEMS Devices
DIE Attachment
High Power LED
Hybrid Assembly
Flip Chip
Package Sealing
Feature of the vacuum reflow oven:
1. Soldering temperature: the maximum soldering temperature of HV3-3 vacuum eutectic furnace is ≥ 500 ºC.
2. Vacuum degree: limit vacuum degree ≤ 10-6 PA working vacuum: 10-6 PA.
3. Effective welding area: ≥ 300mm * 300mm
4. Furnace height: ≥ 100mm, customized for special height.
5. Heating method: infrared heating at the bottom + infrared heating at the top. The heating plate adopts semiconductor silicon carbide graphite platform. It is not easy to deform after long-time use, and has high thermal conductivity, making the surface temperature of the heating plate more uniform.
6. Temperature uniformity: within the effective soldering area ≤± 2%.
7. Heating ramp:120 ºC / minute.
8.Cooling ramp: 60-120 ºC / minute (the ramp of no-load, temperature cooling from 100 ºC).9. Meet the soldering requirements of soldering materials temperature≤ 500 ºC.
For example: In97Ag3, In52Sn48, Au80Sn20, SAC305, Sn90Sb10, Sn63Pb37, Sn62Pb36Ag2 and other preforms (can be soldered without flux eutectic), solder paste of various components, and curing of materials below 500 degrees.
10. Soldering void rate: After a large number of customer verification, when HV3-3 vacuum eutectic furnace solder with soft solder, the void rate can be controlled between 0-3%.
Vacuum reflow furnace Technical parameter:
Model | HV3-3 |
Soldering Size | 300*300mm |
Furnace height | 100mm(other Hights is optional) |
Maximum Temperature | 500ºC |
vacuum | ≤3Pa with mechanical pump,≤10-6Pa with molecular pump |
Heat up ramp | 120 ºC / minute |
Cool down ramp | 60-120 ºC / minute |
Voltage | 220V, 25-60A |
Rated Power | 18KW |
Weight | 360kg |
Dimension | 600*600*1300mm |
Wight | 250KG |
The maximum heating rate | 120ºC/min |
The maximum cooling rate | Only water-cooled 60ºC/min, Air-cooled + water-cooled 120ºC/min |
Cooling Way | Air-cooled / water-cooled (shell, heating plate) |
Soldering result:
Company information:
Complaint
