Sealing of Hermetic Packages Soldering Vacuum Solder Reflow Systems

Applications:
Solder reflow with and without flux
Wafer bump and solder ball reflow
Flip chip
Encapsulation and sealing of housings
High Power LED module
Resistor paste firing
IGBT/DBC
Die attachment
Power Semiconductors
Sensors
MEMS Devices
Hybrid Assembly
Package Sealing

RS Series vacuum reflow oven (RS220/RS330)

Function Introduction:
1.TORCH promotes a new Vacuum Reflow Oven in RS series which is the fifth generation of its small Vacuum Reflow Oven.It especially designed for the fields in small batch production, R&D and functional materials test, etc.

RS series Vacuum Reflow Oven is heated in Vacuum environment to realize holeless soldering, can fulfill the test requirement from R&D department and production requirement of small batch.

RS series Vacuum Reflow Oven applicable to fluxless soldering without hollows at solder pot, available in various of gases, such as N2, N2/H2 95%/5%.

RS series Vacuum Reflow Oven is not only suitable for fluxless soldering, but also suitable for lead free solder paste or solder slice.
RS series Vacuum Reflow Oven is combined with software control system, easy to operate, you can use the software to control the machine and set the temperature profile as well as modify the programming to meet different solder requirement.

2.RS series vacuum oven is mainly for high-demanding in welding, for example industrial high reliability product, even the nitrogen protective or the vapor phase soldering can not reach the demand.Like the material testing,chip package,power equipment, automobile product, train control, space and airborne systems etc soldering which need high reliability circuit.It need elimination and reduce the empty and oxidation welding material.How to reduce the voidage effectively, decrease the oxidation of the pad and the component pins?The vacuum oven is the only choice.If you want to achieve the high welding quality, we must need the vacuum oven machine.

3.Industry application:RS series vacuum oven is the best choice for R&D, process research and development, material test, device packaging, and it is the best option for high-end development and production in industrial enterprises, research institute, colleges, universities aerospace.

Features:

1.Soldering under full vacuum.The vacuum value can be up 10-3mba.(10-6-mba optional)
2.Welding environment is with low activity flux.
3.Professional software control can achieve the perfect operating experience.
4.40 industry segments programmable temperature control system can help to set the perfect technology curve.
5.Temperature settings can be adjusted, which can set the welding materials technology curve that is much closer to perfect the process.
6.Water-cooling technology achieves the industry's fastest cooling effect (standard)
7.Online temperature measurement function.Accurate measurement of the weld zone temperature uniformity.Provide professional support for the process of adjustment.
8.Nitrogen or other inert gas can meet the special requirements of the welding process.
9.Highest temperature is 450 ºC (higher optional), which can meet all the requirements of the soldering process.
10.Allocate five of the industry's most comprehensive system security status monitoring and safety protection design (weldments over temperature protection, machine temperature safety protection, safe operation protection, welding cooling water protection, power protection)
Standard:

Packing List

One set computer
One set industry control computer
One set temperature control software
One set temperature controllor
One set pressure controllor
One set Inert gas or nitrogen gas control valve

Optional:
Corrosion resistant diaphragm pump, vacuum 10mba;
Rotary vane pump, used for vacuum of 10-3mba;
Eddy turn molecular pump system, used for vacuum of 10-6mba;
4.Hydrogen and hydrogen-type safety device
5.High Temperature Module (500 degree high temperature

Vacuum furnace Technical parameter:

Vacuum furnace Standard spare part :