Submicron Placement Accuracy Die Bonder Machine Original Factory

Min.Order: 1
Product origin: Suzhou, Jiangsu, China
Infringement complaint: complaintComplaint
US$ 100000 ~ 300000

Description
 

Product Description

The EH9721 has functions such as rail-to-rail loading and unloading, making it more widely applicable and suitable for mass production of products.

Detailed Photos

  1. High Precision: ±2µm@3σ
  2. High Efficiency: Multiple workstations, fast and accurate temperature and force control
  3. High Flexibility: Multiple suction nozzles for automatic replacement, multiple intermediate stations for free switching, various feeding methods for flexible selection, rail-to-rail loading and unloading
  4. Easy to Expand: Cooperating with customers for process exploration, customizable development, and optional functional modules including Flip Chip.
 

Product Parameters


 
 
 

Product model

EH9721

Placement Accuracy

±2µm@3σ

Placement Angel±0.3°

Placement Process

Eutectic, Underfill, Flip Chip (optional)

Equipment Application

COC,COB,Gold Box,COW,COS

Efficiency

15~25 seconds per piece (Eutectic)

5~7 seconds per piece (Adhesive dipping)

Surface MountTechnology (SMT)module

Nozzle

12 nozzles per single head, dynamictool change

Force Control

(10~50g)±2g,(50~300g)±3%

Transfer Module

Nozzle

/

Force Control

/

Eutectic Module

Workbench

1

Transfer Station

8 (maximum) on a single workbench

Heating method

Pulse heating

TemperatureRange

500°C(highest)

TemperatureRamp Rate

50°C/S(maximum)

Feeding Mode

Wafer

6 inches, supports up to 2pieces

Waffle Pack

Gel-Pak

2 inches,supports up to 9 pieces

Overall dimensions (length × wide × High)

1650mm×1100mm×1800mm

Weight

2000Kg(maximum)

Compressed air

0.4~0.7MPa

Nitrogen gas

0.4~0.7MPa

Ambient temperature

23±2°C

 

After Sales Service

Company Profile

Suzhou BOZHON Semiconductor Co., Ltd. was established in 2022 and is a global semiconductor equipment R&D and manufacturing company. With over 20 years of technical expertise in the semiconductor industry, the company provides leading and stable advanced process and inspection equipment to its customers. Suzhou BOZHON Semiconductor is committed to becoming a leader in the Chinese semiconductor industry by developing and innovating products using micrometer, sub-micrometer, and nanometer-level technologies. The company aims to promote the advancement of semiconductor processes and industry upgrades, and continuously provide cutting-edge products to the industry.
 

FAQ

1.Where does Bozhon Semiconductor come from?
Bozhon Semiconductor is from Suzhou, China and is part of the Bozhon Precision Industry Group.

2.Are the products self-branded or resold?
All products are self-developed, and many technologies have been awarded national patents.

3.What is the minimum order quantity for the product?
1 set.

4.How long does it take to ship an order?
Within 100 days of signing the contract

5.Is the price on the product page the final price?
No, the final price is based on the specific product model, subject to the actual offer.



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